| 초록 |
UV curing process has a very attractive advantages compared to thermal curing. Their major advantages are fast speed cure process, low energy consumption due to operating at low or room temperature, and environmentally-friendly because of solvent free. Cure monitoring as nondestructive evaluation of single carbon fiber/thermosetting composites was evaluated by the measurement of electrical resistivity during curing process. In this study, interfacial properties and microfailure modes of single fiber/thermosetting composites with different curing processes were investigated using micromechanical test. After curing, residual stress was monitored by electro-micromechanical test and then it was compared to correlate with various curing processes. In thermal curing, curing shrinkage appeared significantly by matrix shrinkage and residual stress due to TEC difference. The change in electrical resistance on thermal curing was higher than that on UV curing. Under cyclic loading condition, reaching time until same strain was faster on thermal curing condition than UV curing case. Acknowledgment : This work was financially supported from CAMP of the 21st C Frontier R&D program by MST, through Engineering Research Institute (ERI), GNU.
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