| 학회 | 한국공업화학회 |
| 학술대회 | 2016년 가을 (10/26 ~ 10/28, 제주국제컨벤션센터(ICCJEJU)) |
| 권호 | 20권 2호 |
| 발표분야 | 접착제도료잉크_포스터 |
| 제목 | Development of acrylic adhesives with high heat resistance and wettability for heating process |
| 초록 | This work relates to adhesives for use in fabrication of chip on film and, more particularly, to development heat-resistant adhesives to minimize damage on substrate after heat process for use in printed circuit boards in display industry. This adhesive has many advantages to adapt in the industry such as, above all, a fine adhesiveness difference, high cohesion, excellent removal property, and low glass transition temperation(Tg) between before and after heating process. To be more specific, to obtain low Tg of the adhesive, flexible monomer with -OH group was used and softly removed from substrate without zipping sound even adapting to large size of substrate after heat process. Additionally, to minimize damage of substrate, the adhesive has been designed with high molecular weight, decreasing anchoring effect and minimizing hydrogen bond donor in molecular structure. To prove adhesion, peel strength was measured according to removal speed between before and after heat process. |
| 저자 | 조원섭, 김현주, 여문진, 김정렬, 최환정, 심종배 |
| 소속 | 애경화학 |
| 키워드 | Adhesive; PSA; Acrylic; Heating process; heat-resistant |
