| 초록 |
The shape, size, and orientation of fillers within polymeric matrix are important factors for realizing various composite functionalities. Previously, we found a thermal stiffening but malleable characteristic of poly(hexahydrotriazine) (PHT) and exploited it to maximize hexagonal boron nitride (h-BN) alignment within the PHT by leveraging shear force generated upon manufacturing the composite. Consequently, the final composite exhibited exceptionally high thermal conductivity of 28 W/mK. In this presentation, we will report a detailed comprehensive study regarding a relationship between composite thermal conductivity and the filler type, shape, size, and also its degree of alignment. To further highlight versatility, the composite bearing highly aligned h-BN was applied as gas barrier. We believe the PHT composite material could be useful as packaging material for microelectronics which could also quickly dissipate the generated heat from the electronics to the surroundings. |
