화학공학소재연구정보센터
학회 한국재료학회
학술대회 2021년 가을 (11/24 ~ 11/26, 경주 라한호텔)
권호 27권 2호
발표분야 B. 나노화학/바이오 재료 분과
제목 Electrospun Soy Protein Isolate Based Dual Pore Size Wound Dressing for Enhanced Skin Wound Cure
초록 Electrospun soy protein isolate (ISP) has proved its usefulness as wound cover dressing, but its dense pore size make cell hard to penetrate the dressing and this cell thrive obstacle is related with wound cure speed. As patients who have wide defect should need wound dressings that wound can be cured as fast as possible, focusing on advancing wound cure speed would be necessary to patient welfare. But as dressings which has too large pore can make penetrate easily not only cells but also germs, the outer pore size of wound dressing should be dense. So, in this study, we will make dual pore size dressing from commercial soy protein isolate (ISP) and delve into them to analyze its material properties and cellular prosperities difference between single pore size dressing. Moreover, the dressings will be transplanted on the target defect area and the defect size change would be followed up to compare defect cure speed difference between dual pore size dressing and single pore size dressing.
저자 임한성1, 이병택2
소속 1순천향대, 2순천향대락교 의과대
키워드 <P>electrospinning; wound dressing; soy protein isolate; skin</P>
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