| 초록 |
Planar heating elements have been spotlighted since their 20~40% lower power consumption is possible compared to conventional linear heating elements. High thermal conductivity of the planar package, which is required for effective operation of the heating elements, has been one of the critical properties since it lessens the power consumption of heating element. Recently, several materials, which are non-metals, i.e., SiC, MoSi2, LaCrO3, C, and ZrO2, were reported as candidates for heating elements. In this work, the compositions and properties of thick film over-coating layers deposited on 96% Al2O3 substrate, which is needed to protect or buffer the MoSi2-based heating element from thermal shock, have been investigated over the testing temperatures of 500 to 800℃ by focusing on mechanical and thermal stability. For the thick films, borosilicate glass was admixed with high thermal conduction fillers to optimize TCE and thermal conductivity. Good integrity between the thick films and substrates led to promising results on sustaining heating performance without mechanical breaks up to 800oC. The high thermal conduction filler is believed to be responsible for the promising observation. |
