| 초록 |
Though photosensitive polyimides (PSPIs) have various applications including buffer coat layer for IC chips, conventional PSPIs have disadvantages such as the necessity of high temperature post-curing after pattern formation due to their use of polyimide precursors, poly(amic acid)s, as polymer components. We have developed a novel mechanism to give photosensitivity to polyimides and other engineering plastics and named it reaction development patterning (RDP). RDP-based pattern formation utilizes change in solubility caused by nucleophilic acyl substitution between carboxylic-acid derivatives (imide, carbonate, ester, etc) in a polymer chain and nucleophiles (amines or OH-) in a developer during development process. Thus, in principle, photosensitivity can be given to all the soluble polyimides, polycarbonates and polyesters, and fine patterns are easily obtained from commercially available polyetherimide (Ultem), poly(bisphenol A carbonate), etc. In this lecture, I will present mechanisms and scopes of positive- and negative-tone RDPs. |
