화학공학소재연구정보센터
학회 한국화학공학회
학술대회 2019년 봄 (04/24 ~ 04/26, 제주국제컨벤션센터)
권호 25권 1호, p.870
발표분야 재료(Materials)
제목 Development of die-attach materials with high heat transfer and adhesion
초록 In recent years, the tendency of electronic devices to become smaller, more sophisticated, and larger in capacity has been expanded, and the need for high density and integration of semiconductor packages has been rapidly increasing. If the generated heat does not dissipate and remains inside the electronic modules, the temperature of the element rises and the efficient operation is hindered, resulting in a problem of reduced lifetime due to thermal stress. Thus, heat generated from semiconductors is an important issue, and the development of high reliability heat-sink-materials is more important than ever.
Therefore, in this study, we optimized the welding characteristics and densification of the silver powder mixing with synthesized silver complex to develop a die-attach paste with high heat dissipation and adhesion strength. As a result, sintering between silver particles was effectively carried out even at a low temperature of 230 ℃, and volume resistivity of sintered Ag paste was about 2.07 μΩ•cm. As a result of thermal conductivity measurement, it showed high heat-dissipation characteristics of 199.6 W/mK, and excellent adhesion characteristics of 2.90 kgf / mm2.
저자 강신혜, 박지선, 김윤진
소속 전자부품(연)
키워드 재료
E-Mail
원문파일 초록 보기