| 학회 |
한국공업화학회 |
| 학술대회 |
2014년 가을 (11/12 ~ 11/14, 엑스코(대구)) |
| 권호 |
18권 2호 |
| 발표분야 |
정보전자소재-포스터 |
| 제목 |
Effects of Particle Size Distribution on Sintering Properties of Silver Coated Copper Paste |
| 초록 |
Conductive paste has been widely used as an electrode with the form of thick film. Among the other materials, silver is an admiring material to produce the highly conductive and stable layer through a facile sintering process in this thick film technology. However, the demands of alternative metal based conductive paste are increased for the industrial application due to the price competitiveness. Although copper can be easily oxidized, this low cost metal can be a promising candidate for the purpose of the conductive filler. In this study, the conductive paste was prepared using silver coated copper particles. Particularly, in order to examine the sintering properties of the paste at below 890oC, several pastes composed of different filler size distribution were investigated. As a result, it was found that the sheet resistance and shrinkage of the conductive thick film were strongly related to the densification by the size distribution of the silver coated copper paste. |
| 저자 |
이성윤1, 김재영1, 이준영2, 신교직1, 최경호1, 이상국1
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| 소속 |
1한국생산기술(연), 2성균관대 |
| 키워드 |
silver coated copper paste; sintering process
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| E-Mail |
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