| 초록 |
The hot-melt adhesive is an adhesive having a 100% solids content, which is a main component of a thermoplastic resin, and is an adhesive that is melted by heatm applied to an adherend, solidified by cooling. The purpose of this study is to design blend of hot-melt adhesives using polyamide resin, and this was done by adding additives to show adhesion to self bonding wire for coil. The melt flow index, melt viscosity, softening point and tensile strength were measured according to additives ratio, and the adhesion of thermohygrostat was compared for the evaluation of heat resistance and moisture resistance. |
