| 초록 |
A silver complex ink was prepared by dissolving silver neodecanoate in co-solvent, toluene and Iso propanol, up to a concentration of 58 wt.% silver. Silver complex colloid has been characterized by TEM, FT-IR and TGA. Bar coated Ag complex ink films were thermally reducted to metallic silver films with a resistivity of less than 1.1665 x 106 Ωcm, after sintering at 200 oC. The 58 wt.% silver complex ink had a viscosity of about 15.78 cPs and surface tension of 31.9 dyne cm1 at 20 C, which is appropriate for printing jobs. Continuous and smooth lines of 50 μm width could be printed on poly imide film using a Dimatix Materials Printer (DMP-2800). After baking at 200 C for 30 min., these lines exhibited a resistivity of less than 5×105 Ωcm, which could serve as conducting lines for electronic applications. |
