| 초록 |
Epoxy compounds, which contained silica as an inorganic filler, were widely used for underfill applications. In this study, the epoxy/silica systems were cured using an imidazole catalyst. And the effect of silica content to epoxy resin on the flow, thermal, and mechanical properties was investigated. The flow properties of epoxy compounds were evaluated from the flow rate measurement and the coefficients of thermal expansion (CTE) of the cured specimen were measured by thermo-mechanical analyzer (TMA). Also, the adhesion strengths as mechanical properties were determined by the die shear strength testings. |
