| 초록 |
Coupling agents, which contained silane groups as an adhesion promoter, were widely used for underfill applications. In this study, the different silane coupling agents were added into the epoxy/silica compounds. And the effect of the silane coupling agents content to epoxy/silica compounds on the flow, thermal, and mechanical properties was investigated. The curing behavior was studied with a differential scanning calorimeter (DSC) and flow property of the epoxy compounds was evaluated from the flow rate measurement. Also, the adhesion strength as a mechanical property was determined by the die shear strength testing. |
