| 학회 |
한국고분자학회 |
| 학술대회 |
2017년 봄 (04/05 ~ 04/07, 대전컨벤션센터) |
| 권호 |
42권 1호 |
| 발표분야 |
고분자가공/복합재료 |
| 제목 |
High Performance PCB Materials Based on Polybenzoxazine |
| 초록 |
Printed circuit board (PCB) which is composed of multiple layers of insulator and copper sheets works as a support to connect electric components. To prepare insulating layer, a lot of approaches have been studied for thermosetting polymer. Especially, epoxy resins display physical stability and strong adhesion to copper layer. However, Single epoxy resin has crucial limitation of insulation performance to meet required value. To overcome this problem, benzoxazine is big interested as a new concept of electric insulating materials because generated hydroxyl groups. In this study, silica nanoparticle was introduced to benzoxazine based hybrid film showing improved mechanical strength and reduction of dissipation factor. Monobenoxazine and linear polybenzoxazine were employed as a main thermosetting materials with silica nanoparticle. Finally, linear polybenzoxazine and epoxy/silica hybrid film was prepared showing enhanced adhesion to copper and excellent electrical insulation property. |
| 저자 |
이선호1, 안철희2
|
| 소속 |
1Research Institute of Advanced Materials (RIAM), 2Department of Materials Science and Engineering |
| 키워드 |
Benzoxazine; PCB; cure; hybrid; silica
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| E-Mail |
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