| 초록 |
Epoxy resins have been widely used as electrical insulation materials because of their strong adhesive properties, mechanical and thermal properties. As a matrix resin for PCB, epoxy resins are required to have higher Tg and low CTE value. In order to enhance the thermal properties of epoxy system, we synthesized liquid crystalline polyester(LCP) carrying amide linkage and added it to DGEBA/DDS system by solvent assisted mixing. Several specimen were prepared by changing the content of LCP and their mechanical and thermal properties were examined by using UTM, DSC, and TMA, respectively. |
