| 초록 |
As power density of modern electronics has increased, appropriate cooling of electronics has become a critical issue that limits the performance of devices. The solution requires knowledge of heat transport in device components. As graphene shows the highest-ever-observed thermal conductivity along the plane, layered two-dimensional materials have been considered as good thermal conductors. In this talk, I will present how heat transport occurs in layered materials and at their interfaces. I will focus on several layered materials with distinct in-plane anisotropy, which provides more degrees of freedom for thermal transport. These materials include black phosphorus, WTe2, and ReS2. The thermal transport properties are determined by using time-domain thermoreflectance of conventional and beam-offset configurations. As expected from the layered structures, in-plane heat transport is superior to through-plane heat transport by more than an order of magnitude. Also, the interface of the layered materials with metals shows extremely low thermal conductance, which can seriously limit cooling of the layered material-based devices. I will discuss the intrinsic limit and the possible ways to tune the interfacial thermal conductance of the layered materials. |
