| 학회 |
한국공업화학회 |
| 학술대회 |
2017년 가을 (11/08 ~ 11/10, 부산 벡스코(BEXCO)) |
| 권호 |
21권 2호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Study on Thermal Properties of Silane-Modified hardener for Epoxy Adhesive |
| 초록 |
Epoxy resins are used in the polymer industry such as coatings, adhesives, and insulation. In addition, it is a typical thermosetting resin widely used in the electronic device industry because of its excellent electrical insulating properties, low mold shrinkage, excellent adhesion and heat resistance. It is required to develop a low temperature curing type epoxy adhesives capable of lowering the curing temperature without lowering the productivity. In this paper, we studied the thermal characteristics according to the composition of various hardeners of epoxy adhesives. The hardeners were synthesized by sol-gel condensation reaction of (3-mercaptopropyl)-dimethoxysilane (MPDMS), (3-mercaptopropyl)-trimethoxysilane (MPTMS), trimethoxy(octyl)silane (TMOS). |
| 저자 |
강호용, 임종태, 석웅철, 권세진, 강주희, 송호준, 이상국
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| 소속 |
한국생산기술(연) |
| 키워드 |
epoxy adhesive; silane; hardener; curing behavior; sol-gel method.
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| E-Mail |
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