| 학회 |
한국화학공학회 |
| 학술대회 |
2002년 가을 (10/24 ~ 10/26, 서울대학교) |
| 권호 |
8권 2호, p.5214 |
| 발표분야 |
재료 |
| 제목 |
구리의 화학,기계적 연마용 실리카 슬러리의 안정화에 관한 유변학적 연구 |
| 초록 |
The efficiency of CMP is greatly dependent on the stability of slurry. The particles in stable slurry are well dispersed by overcoming attractive van der Waals forces. Polymeric surfactants such as poly(vinyl alcohol) and poly(acrylic acid) can be used as steric stabilizer. In this paper, the stability of silica slurry is investigated with rheological method. The effect of various volume fractions, and pH were investigated. PVA and PAA were chosen as polymeric stabilizer and the stabilizing effect of the amount added was studied. And the effect of molecular weight of PAA added was observed. |
| 저자 |
최영훈, 배선혁, 양승만, 김도현
|
| 소속 |
한국과학기술원 생명화학공학과 |
| 키워드 |
Chemical mechanical polishing; Copper
|
| E-Mail |
, , , |
| 원문파일 |
초록 보기 |
