| 학회 |
한국화학공학회 |
| 학술대회 |
2004년 봄 (04/23 ~ 04/24, 공주대학교) |
| 권호 |
10권 1호, p.925 |
| 발표분야 |
재료 |
| 제목 |
Microscopic analysis of adhesion interphase in the composite made up of rubber compound and nano-copper-coated iron plate |
| 초록 |
The nano-copper-coated iron plates were prepared by sputtering technique and the adhesion interphases to rubber compound after cure were characterized by TM-AFM and AES depth profiles. From the analyses of AES depth profiles, the thickness of adhesion interphases to rubber compound increased with increase of copper plating to iron plate. From the surface roughness of adhesion interphases calculated from root mean square determined by TM-AFM, adhesion interphase of nano-copper-coated iron plates is significantly small compared to that of brass plate. The controlled formation of adhesion interphase in nano-copper-coated iron plate to rubber compound indicated the excellent adhesion retention and possibility of a new material to reinforce rubber compound. |
| 저자 |
전경수1, 정승원1, 최석주2
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| 소속 |
1남도대, 2금호타이어(주) 컴파운드개발팀 |
| 키워드 |
adhesion interphase; rubber compound; nano-copper-coated iron plate; AES; AFM
|
| E-Mail |
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| 원문파일 |
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