| 학회 |
한국공업화학회 |
| 학술대회 |
2017년 가을 (11/08 ~ 11/10, 부산 벡스코(BEXCO)) |
| 권호 |
21권 2호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Curing Behavior of Epoxy Resins by Mercaptan Hardener at Low Temperature |
| 초록 |
Adhesives are composed of epoxy resins, hardener and catalyst. Epoxy resins are important thermosetting polymers widely deployed in industrial applications including adhesives, coatings and electronics due to their high utility. The curing process of the epoxy resins can be carried out using a wide range of curing agents, such as amines, anhydrides, polyamides, phenol form aldehyde resins and polysulfides. In order to increase the productivity, it is required to epoxy adhesives rapidly cured at a low temperature. At low temperatures, the curing reaction of epoxy and mercaptan is faster than the reaction of epoxy and amine. In this paper, we studied the curing behaviors of diglycidyl ether of bisphenol A (DGEBA) with modified mercaptan hardener. We synthesized mercapto-copolymer by the sol-gel method for fast and low temperature curing. |
| 저자 |
강호용, 임종태, 석웅철, 권세진, 강주희, 송호준, 이상국
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| 소속 |
한국생산기술(연) |
| 키워드 |
mercaptan hardener; epoxy adhesive; curing behavior
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| E-Mail |
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