| 초록 |
In the latest embodiments of micro-electronic technology, a single device is composed of different types of transistors which are integrated to achieve high performance. Consequently, the need for increased heat flux due to power dissipation is required in many devices. To ensure high performance and long-term stability of the devices, operating temperatures should need to be maintained at an appropriate level. Therefore, heat dissipation has emerged as a serious issue for the performance and lifespan of microelectronics and battery packaging. Such issues in microelectronic devices have been resolved by the use of metal heat sinks, which are often susceptible to thermal cracking, short circuit and are of limited utility in thinner packages. Further, additional ground connections are necessary for such heat sinks to prevent malfunction of the devices. As an alternative for heat dissipation materials in microelectronics, polymer-based ceramic composites have received much attention nowadays due to their ease of processing and low cost. However, the properties of the composite also depend on the direction of filler orientation. Considering the economic feasibility of the polymer/ceramic composite, reasonable composite properties should ideally be obtained by the use of the minimum amount of high conductive filler, such as BN, CNT, Graphine. Traditionally, diverse composite fabrication techniques such as shear forces and mechanical mixing have been used; however, these require a considerable amount of filler to obtain the desired composite properties even though these properties rely only on the orientation of the filler in the matrix. For ensuring moderate and size independent properties of the composite with the use of minimum amounts of the filler, three-dimensional uniform conductive pathways should be created and maximized via direct contact between fillers. In this presentation, we propose a new strategy to ensure uniform orientation of fillers, maximizing the percolation created by filler–filler contact in the matrix by unique methodology. |
