| 초록 |
Adhesion characteristics of copper films on the polymer film were investigated with special attention to chromic acid pretreatment. The copper film was deposited by ECR-MOCVD coupled with a periodic DC bias at room temperature. The employed copper precursor was Cu(hfac)2(hfac : 1,1,1,5,5,5-hexafluoro-2,4-pentandione) and hydrogen used reactive gas and argon used as a carrier gas, respectively. Polyethylene terephthalate(PET) film used as substrate. The adhesion of copper/PET film was carried out with a pull-off test by using an Instron®. Surface roughness before and after deposition of chromic acid pretreated samples were investigated by AFM(Atomic Force Microscopy) and surface energy was calculated by the contact angle measurement. In our results, surface morphology of deposited film was affected by surface roughness of pretreated PET film before the deposition. Copper film with good adhesion could be obtained at maximum value of surface roughness and surface energy. |
