| 초록 |
Polymeric composites with metal fillers are used for electronic packaging and thermal management. The electrical conductivity of metal-filled composites is usually understood in terms of percolation theory, when a sufficient amount of conductive fillers is loaded into an insulating matrix, the composite transforms from an insulator to a conductor. It is evident that the percolation threshold is related to the occurrence of continuous conducting paths in a metal/insulator composite. Furthermore, the dispersion condition and aggregated structure in the metal-filled polymer composites can be evaluated by rheological measurements. In the high volume fraction, the resulting aggregates have a very complex structure and for many systems structural changes are not reversible. In such systems the agglomerations gradually break down when shear rate are increased, therefore thermal/electrical property was changed. In this study, the contribution of the dispersion structure to the rheological property and thermal/electrical conductivity can be predicted from the viewpoint of percolation theory. |
