| 초록 |
Wastes of thermosetting resins have caused many environmental problem as they were difficult to degrade due to their network structures. Epoxy resins are one of the most important classes of thermosetting polymers for electronic parts such as printed circuit boards and encapsulants. As a part of studies for recycling of electronic parts, we have been investigating the decomposition behavior of diglycidylether of bisphenol-A(YD-128, K사) and brominated diglycidylether bisphenol-A(DIM-110) cured with dicyan diamide depending on glycol types. In this work, diethylene glycol(DEG), diethanol amine(DEA) and bisphenol-A(BPA) as solvolytic reagent were used. The reaction was carried out at 200℃ up to 16 hours. Properties of decomposition product were analyzed employing an intra-red spectroscopy (FT-IR), thermogravitic analysis (TGA) and nuclear resonance spectrometer (NMR). It was found that glycolyses of the cured epoxy resins occurred fast in the following order; DEA＞DEG≥ BPA |
