초록 |
Hexagonal boron nitride (h-BN) powder can be widely used as a filler for heat dissipating materials because of its high thermal conductivity and stability. However, thermal conductivity of h-BN in polymer has been found to be far below than expected owing to interfacial resistance and dispersion issue. Here we have tried and developed experimental schemes. Multi-functional treatments using multiple silanes, delamination by chemical and ultrasound treatments into BN nanosheets, and shape dependent bi and multi-modal filler systems including sheets, tubes, and dot have been tried. Additionally curing systems of epoxy resin have been optimized. The surface modification and delamination of h-BN were characterized by FTIR, SEM, TEM, and Raman scattering. Thermal conductivity of the composite was analyzed by laser flash method. |