| 학회 | 한국고분자학회 |
| 학술대회 | 2004년 가을 (10/08 ~ 10/09, 경북대학교) |
| 권호 | 29권 2호, p.474 |
| 발표분야 | 고분자 합성 |
| 제목 | Synthesis and characterization of copoly(epoxy-imide) films |
| 초록 | For the chemical reaction between polyimide and epoxy, the hydroxyl-containing fully aromatic soluble copolyimides based on 2,2-bis(3,4’-dicarboxyfluoropropane) (6FDA), 2,2-bis(3-amino-4-hydroxylphenyl)-hexafluoropropane (AHHFP), and 4,4'-Oxydianiline(ODA) were prepared by chemical imidization method with different AHHFP/ODA ratio. Bihenyl type epoxy resin (4,4’-diglycidyloxy-3,3’,5,5’-tetramethyl biphenyl), phenol novolac resin(PN), and triphenyl phosphite(TPP) were mixed in NMP with copolyimides and cured at 150°C for 1h, 250°C for 2h on silicon wafer. Thermal, dielectric, and residual stress properties of the copoly(epoxyimides) was investigated by TGA, TFDA(Thin Film Dielectric property Analyzer) and TFSA (Thin Film Stress Analyzer) respectively. In addition, the morphology of copoly(epoxyimides) were studied by Prism-Coupler. Acknowledgment: This work was supported by Center for Electronic Packaging Materials of Korea Science and Engineering Foundation. |
| 저자 | 양승진, 신대용, 장원봉, 권진욱, 설용건, 한학수 |
| 소속 | 연세대 |
| 키워드 | polyimide; epoxy; residual stress |
