| 초록 |
As the growing of smart device market, various functions in the single device are required. The smartphone becomes slim, light, multi-function, even though, more and more functions were built in. These trend makes that the circuit board was highly integrated. It causes Electromagnetic interference (EMI). Electically Conductive Adhesives(ECAs) which is produced for EMI shielding is combined with polymer binder and conductive filler. We used the multifunctional acrylate as binder to control shrinkage in UV curing. And various shape of silver particle was used as filler to get UV curable property and Isotropic conductivity. We investigate the change of sheet resistance and surface property depends on polymer shrinkage and type of filler. |
