| 초록 |
Electroplating is employed in industry to improve the appearance of surfaces, to give the good corrosion protection on the substrate, to improve the wear resistance by hard facing of the relatively soft substrate, and sometimes to provide the good electrical and thermal contact. In plating process, acid and alkali aqueous solutions, heavy metal, corrosive materials, and toxic substances were used, the pollution of working environment raised because of waste water. Since the latter half of 1990's, the research about the effective method to treat the waste water were began centering around industries and research organizations. By this tendency, cleaning techniques were required in plating technology in domestic plating industries and for that reason, the current equipment are in need of changing into the environmental friendly-technical installations. In this paper, we offer the new idea, the technology to reduce the plating solution by using sc CO2. This is the method that the plating solution in sc CO2 emulsion using fluorinated analogues of AOT with the 'CO2 philic' tail and the 'hydro philic'group was formed and Ni in this emulsion have deposit in Cu subs trate. This process has advantages of the high speed-plating, the plating in detail and the reduction of plating solution. Prior to achieving this study, Ni electroplating on Cu plate in solution composed of CO2 and plating solution was practiced. This electroplating by the new technology was result in reducing the plating solution(1/4~1/7times). Quality value of plated ware evaluated by using the plating thickness, corrosion resistance, uniform on surface of plated ware, and efficiency of plating. We are trying to develop the quality of plated ware and more detailed study is now in progress.
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