| 학회 | 한국고분자학회 |
| 학술대회 | 2003년 봄 (04/11 ~ 04/12, 연세대학교) |
| 권호 | 28권 1호, p.147 |
| 발표분야 | 복합재료 |
| 제목 | Interfacial Properties between Poly(hydroxyamide) and Copper |
| 초록 | Adsorption of polymers onto metal surface is important in applications such as adhesive bonding, corrosion protection, wetting control, biocompatibility, electrochemistry and many other areas. Accordingly, understanding the interfacial characteristics between polymer and metal is necessary to control their chemical and physical properties. In this study, we investigated the adsorption behavior of the poly(hydroxyamide) (PHA) onto the copper surface. The adhesive strength of PHA/copper system was measured by lap-shear test. Result from X-ray photoelectron spectroscopy (XPS) and reflection- absorption infrared spectroscopy (RAIR) revealed that the polar groups in PHA interact specifically with copper surface. In PHA bulk film, the carbonyl groups in polymer chain formed hydrogen bond with hydroxyl group and amide group. But at the interface, the polar groups in polymer chain interact with copper, so the hydrogen bond was partially destroyed. The quantitative analysis of XPS spectra indicated that the polar groups in PHA increased at near the interface. |
| 저자 | 이원옥;백두현 |
| 소속 | 충남대 |
| 키워드 | interface; poly(hydroxyamide); copper |
