| 초록 |
Organic light-emitting diodes require a passivation layer that protects the active layers from moisture and oxygen because most organic materials and electrodes are very sensitive to such gases. Passivation films for the encapsulation of organic electronic devices need excellent stability and mechanical properties. Alloys have been used as materials in ceramic and electronic fields due to their enhanced physico-chemical properties. Nano-laminate technique using plasma-enhanced atomic layer deposition (PEALD) is the one of the method to obtain alloy type thin film. We were fabricated OLED devices and then deposited stacks of Al2O3 and TiO2 layer in angstrom scale for OLED encapsulation using PEALD process. The film properties including composition, water resistance, water vapor transmission rate, and surface morphology were investigated. In addition, electrical characteristics (I-V-L), EL spectra, and shelf lifetime of encapsulated OLED devices were evaluated. |
