| 초록 |
Two-dimensional hexagonal boron nitride (h-BN) has excellent and useful mechanical and thermal properties, and can be used as a novel filler to enhance the thermal conductivity of polymer composites. We prepared exfoliated h-BN nanoplatelets (BNNPs) with hydroxyl functional groups using a hydroxide-assisted ball milling process, and demonstrated the enhanced thermal conductivity of its epoxy nanocomposites. The prepared BNNPs are highly soluble and retain their in-plane structure. The dielectric constant, and dielectric loss of the nanocomposites increases with the addition of BNNPs. Notably, the thermal conductivity of the epoxy nanocomposites with 10% mass fraction of BNNP was 0.57 W/m·K, which is 2.85 times higher than that of neat epoxy. This enhanced performance is ascribed to the high quality and dispersion of the BNNPs and their strong interfacial bonding with the epoxy matrix, produced by the hydroxyl functional groups on the BNNPs. The overall results suggest that the BNNP/epoxy nanocomposite have strong potential for application as electronic packaging materials. |
