| 초록 |
A printed circuit board (PCB) is a substrate that enables to make the connection possible between electric components by multiple layers composed of copper and insulator sheets. Epoxy resins, one of the commercial thermosetting polymer, display physical stability and strong adhesion to the copper layer. However, the Single epoxy resin has the crucial limitation of insulation performance. Recently, benzoxazine is big interested as a new concept of electric insulating materials because generated hydroxyl groups are strongly tied by hydrogen bonding. In this study, silica nanoparticle was introduced to the benzoxazine based hybrid film showing improved mechanical strength and reduction of dissipation factor. Monobenoxazine and linear polybenzoxazine were employed as a main thermosetting materials with silica nanoparticle. Finally, linear polybenzoxazine and epoxy/silica hybrid film were prepared showing enhanced adhesion to copper and excellent electrical insulation property. |
