검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Properties of PEG, PPG and Their Copolymers: Influence on Copper Filling of Damascene Interconnects Ryan K, Dunn K, van Eisden J, Adolf J Journal of the Electrochemical Society, 160(12), D3186, 2013 |
| 2 |
Predictive Analytical Fill Model of Interconnect Metallization Providing Optimal Additives Concentrations Adolf J, Landau U Journal of the Electrochemical Society, 158(8), D469, 2011 |