검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
A peel adhesion study of electroless Cu layers on polymer substrates Kim SC, Seong H, Ahn KO, Choi DJ, Lee JY, Ko YJ, Yoon SB, Seo ML, Kim YH Journal of Adhesion, 94(1), 1, 2018 |
| 2 |
Adhesion Study between Electroless Seed Layers and Build-up Dielectric Film Substrates Sun JY, Hong DH, Ahn KO, Park SH, Park JY, Kim YH Journal of the Electrochemical Society, 160(3), D107, 2013 |