검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization Zhong WH, Chan YC, Wu BY, Alam MO, Guan JF Journal of Materials Science, 42(13), 5239, 2007 |
| 2 |
Effect of current stressing on the reliability of 63Sn37Pb solder joints Wu BY, Chan YC, Zhong HW, Alam MO Journal of Materials Science, 42(17), 7415, 2007 |