검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Void Density Reduction at the Cu-Cu Bonding Interface by Means of Prebonding Surface Passivation with Self-Assembled Monolayer Lim DF, Ang XF, Wei J, Ng CM, Tan CS Electrochemical and Solid State Letters, 13(12), H412, 2010 |
| 2 |
A thermal and passivation study of self-assembled monolayers on thin gold films Ang XF, Li FY, Wei J, Tan WL, Wong CC Thin Solid Films, 516(16), 5721, 2008 |
| 3 |
Enhancing direct metal bonding with self-assembled monolayers Chin LC, Ang XF, Wei J, Chen Z, Wong CC Thin Solid Films, 504(1-2), 367, 2006 |
| 4 |
Temperature and pressure dependence in thermocompression gold stud bonding Ang XF, Zhang GG, Wei J, Chen Z, Wong CC Thin Solid Films, 504(1-2), 379, 2006 |