검색결과 : 29건
| No. | Article |
|---|---|
| 1 |
Area-Selective Atomic Layer Deposition of TiN Using Trimethoxy(octadecyl)silane as a Passivation Layer Zheng L, He W, Spampinato V, Franquet A, Sergeant S, De Gendt S, Armini S Langmuir, 36(44), 13144, 2020 |
| 2 |
Area selective grafting of siloxane molecules on low-k dielectric with respect to copper surface Rezvanov A, Gornev ES, de Marneffe JF, Armini S Applied Surface Science, 476, 317, 2019 |
| 3 |
Self-focusing SIMS: A metrology solution to area selective deposition Spampinato V, Armini S, Franquet A, Cunard T, van der Heide P, Vandervorst W Applied Surface Science, 476, 594, 2019 |
| 4 |
Metal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residues Krishtab M, De Marneffe JF, Armini S, Meersschaut J, Benders H, Wilson C, De Gendt S Applied Surface Science, 485, 170, 2019 |
| 5 |
On the use of (3-trimethoxysilylpropyl) diethylenetriamine self-assembled monolayers as seed layers for the growth of Mn based copper diffusion barrier layers Brady-Boyd A, O'Connor R, Armini S, Selvaraju V, Hughes G, Bogan J Applied Surface Science, 427, 260, 2018 |
| 6 |
Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers Bogan J, Brady-Boyd A, Armini S, Lundy R, Selvaraju V, O'Connor R Applied Surface Science, 462, 38, 2018 |
| 7 |
Surface sealing using self-assembled monolayers and its effect on metal diffusion in porous low-k dielectrics studied usingmonoenergetic positron beams Uedono A, Armini S, Zhang Y, Kakizaki T, Krause-Rehberg R, Anwand W, Wagner A Applied Surface Science, 368, 272, 2016 |
| 8 |
Wafer Scale Copper Direct Plating on Thin PVD RuTa Layers: A Route to Enable Filling 30 nm Features and Below? Armini S, El-Mekki Z, Nagar M, Radisic A, Vereecken PM Journal of the Electrochemical Society, 161(10), D564, 2014 |
| 9 |
Nucleation Kinetics of Electroless Cu Deposition on Ruthenium Using Glyoxylic Acid as a Reducing Agent Inoue F, Philipsen H, van der Veen MH, Van Huylenbroeck S, Armini S, Struyf H, Tanaka T Journal of the Electrochemical Society, 161(14), D768, 2014 |
| 10 |
Impact of Plasma Pretreatment and Pore Size on the Sealing of Ultra-Low-k Dielectrics by Self-Assembled Monolayers Sun YT, Krishtab M, Struyf H, Verdonck P, De Feyter S, Baklanov MR, Armini S Langmuir, 30(13), 3832, 2014 |