1 |
A Thermodynamic Study of Adsorption of Benzyl Viologen and Polyethylene Glycol and Their Displacement by 3-Mercapto-1-Propanesulfonate during Copper Electrodeposition Lu J, Barkey DP Journal of the Electrochemical Society, 165(5), D231, 2018 |
2 |
On the Displacement of Adsorbed Polyethylene Glycol by 3-Mercapto-1-Propanesulfonate during Copper Electrodeposition Kreider A, Barkey DP, Wong EH Journal of the Electrochemical Society, 161(12), D663, 2014 |
3 |
NMR Spectral Studies of Interactions Between the Accelerants SPS and MPS and Copper Chlorides Garcia-Cardona E, Wong EH, Barkey DP Journal of the Electrochemical Society, 158(3), D143, 2011 |
4 |
Nucleation of tin and tin-silver alloy on copper and nickel in acid plating baths Zhang Z, Barkey DP Journal of the Electrochemical Society, 154(10), D550, 2007 |
5 |
Surface adsorption of PEG and Cl- additives for copper damascene electrodeposition Jin Y, Kondo K, Suzuki Y, Matsumoto T, Barkey DP Electrochemical and Solid State Letters, 8(1), C6, 2005 |
6 |
Influence of additives on the growth velocity and morphology of branching copper electrodeposits Pasquale MA, Barkey DP, Arvia AJ Journal of the Electrochemical Society, 152(3), C149, 2005 |
7 |
High-aspect-ratio copper-via-filling for three-dimensional chip stacking - II. Reduced electrodeposition process time Kondo K, Yonezawa T, Mikami D, Okubo T, Taguchi Y, Takahashi K, Barkey DP Journal of the Electrochemical Society, 152(11), H173, 2005 |
8 |
Pattern recognition and scaling studies of copper electrodeposition on Cu(100) in the presence of additives Wu A, Barkey DP Journal of the Electrochemical Society, 150(8), C533, 2003 |
9 |
A reaction-plane model for the open-circuit potential of copper in aerated copper sulfate solution Barkey DP, Oberholtzer F, Wu Q Journal of the Electrochemical Society, 145(2), 590, 1998 |
10 |
The Role of Induced Convection in Branched Electrodeposit Morphology Selection Barkey DP, Watt D, Liu Z, Raber S Journal of the Electrochemical Society, 141(5), 1206, 1994 |