검색결과 : 20건
No. | Article |
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1 |
Effect of devitrification on the survival and resistance of dried Saccharomyces cerevisiae yeast Ribert P, Dupont S, Roudaut G, Beney L Applied Microbiology and Biotechnology, 105(16-17), 6409, 2021 |
2 |
Efficient stabilisation of curcumin microencapsulated into yeast cells via osmoporation de Medeiros FGM, Dupont S, Beney L, Roudaut G, Hoskin RT, Pedrini MRD Applied Microbiology and Biotechnology, 103(23-24), 9659, 2019 |
3 |
Influence of the air humidity on the drying of a liquid droplet on a solid plate and on bacterial destruction Laguerre O, Lecoq L, Zoz F, Guyot S, Beney L, Flick D Journal of Food Engineering, 212, 76, 2017 |
4 |
Fisetin yeast-based bio-capsules via osmoporation: effects of process variables on the encapsulation efficiency and internalized fisetin content de Camara AA, Dupont S, Beney L, Gervais P, Rosenthal A, Correia RTP, Pedrini MRD Applied Microbiology and Biotechnology, 100(12), 5547, 2016 |
5 |
Osmoporation: a simple way to internalize hydrophilic molecules into yeast Pedrini MRD, Dupont S, Camara AD, Beney L, Gervais P Applied Microbiology and Biotechnology, 98(3), 1271, 2014 |
6 |
Survival kit of Saccharomyces cerevisiae for anhydrobiosis Dupont S, Rapoport A, Gervais P, Beney L Applied Microbiology and Biotechnology, 98(21), 8821, 2014 |
7 |
Air-drying kinetics affect yeast membrane organization and survival Lemetais G, Dupont S, Beney L, Gervais P Applied Microbiology and Biotechnology, 96(2), 471, 2012 |
8 |
Protection of active aroma, compound against moisture and oxygen by encapsulation in biopolymeric emulsion-based edible films Hambleton A, Debeaufort F, Beney L, Karbowiak T, Voilley A Biomacromolecules, 9(3), 1058, 2008 |
9 |
Controlling the membrane fluidity of yeasts during coupled thermal and osmotic treatments Simonin H, Beney L, Gervais P Biotechnology and Bioengineering, 100(2), 325, 2008 |
10 |
Mechanism of nanocapsules formation by the emulsion-diffusion process Moinard-Checot D, Chevalier Y, Briancon S, Beney L, Fessi H Journal of Colloid and Interface Science, 317(2), 458, 2008 |