검색결과 : 12건
No. | Article |
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1 |
Aldehydes and Ketones Form Intermediate pi Complexes with the Gilman Reagent, Me2CuLi, at Low Temperatures in Tetrahydrofuran Bertz SH, Hardin RA, Ogle CA Journal of the American Chemical Society, 135(26), 9656, 2013 |
2 |
Rapid Injection NMR Reveals eta(3)'pi-Allyl' Cu-III Intermediates in Addition Reactions of Organocuprate Reagents Bertz SH, Hardin RA, Murphy MD, Ogle CA, Richter JD, Thomas AA Journal of the American Chemical Society, 134(23), 9557, 2012 |
3 |
Complexes of Gilman Reagents with C-S and C-N Double Bonds: sigma or pi Bonding? Bertz SH, Moazami Y, Murphy MD, Ogle CA, Richter JD, Thomas AA Journal of the American Chemical Society, 132(28), 9549, 2010 |
4 |
Preparation of sigma- and pi-allylicopper(III) intermediates in S(N)2 and S(N)2' reactions of organocuprate(I) reagents with allylic substrates Bartholomew ER, Bertz SH, Cope S, Murphy M, Ogle CA Journal of the American Chemical Society, 130(34), 11244, 2008 |
5 |
Rapid injection NMR in mechanistic organocopper chemistry. Preparation of the elusive copper(III) intermediate Bertz SH, Cope S, Murphy M, Ogle CA, Taylor BJ Journal of the American Chemical Society, 129(23), 7208, 2007 |
6 |
Remarkable effect of silyl groups on asymmetric induction in a conjugate addition reaction with O-methylnorephedrine-based N-silylamidocuprates Bertz SH, Ogle CA, Rastogi A Journal of the American Chemical Society, 127(5), 1372, 2005 |
7 |
Rapid-injection NMR study of lodo- and cyano-gilman reagents with 2-cyclohexenone: observation of pi-complexes and their rates of formation(1) Bertz SH, Carlin CM, Deadwyler DA, Murphy MD, Ogle CA, Seagle PH Journal of the American Chemical Society, 124(46), 13650, 2002 |
8 |
Higher-Order Cuprates Bertz SH Chemical & Engineering News, 75(15), 4, 1997 |
9 |
New Copper Chemistry .27. Beta-Silyl Organocuprates - The Grail of Organocuprate Chemistry Bertz SH, Eriksson M, Miao GB, Snyder JP Journal of the American Chemical Society, 118(44), 10906, 1996 |
10 |
Atom Economical Reactions Bertz SH Chemical & Engineering News, 73(40), 5, 1995 |