화학공학소재연구정보센터
검색결과 : 5건
No. Article
1 Optical endpoint detection for chemical mechanical planarization
Bibby T, Adams JA, Holland K
Journal of Vacuum Science & Technology B, 17(5), 2378, 1999
2 Effects of carrier film physical properties on WCMP
Wang D, Zutshi A, Bibby T, Beaudoin SP, Cale TS
Thin Solid Films, 345(2), 278, 1999
3 Assessment of post-CMP cleaning mechanisms using statistically-designed experiments
Zhang G, Burdick G, Dai F, Bibby T, Beaudoin S
Thin Solid Films, 332(1-2), 379, 1998
4 Von-Mises Stress in Chemical-Mechanical Polishing Processes
Wang D, Lee J, Holland K, Bibby T, Beaudoin S, Cale T
Journal of the Electrochemical Society, 144(3), 1121, 1997
5 Stress distribution in chemical mechanical polishing
Srinivasa-Murthy C, Wang D, Beaudoin SP, Bibby T, Holland K, Cale TS
Thin Solid Films, 308-309, 533, 1997