검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers Miller A, Yu L, Blickensderfer J, Akolkar R Journal of the Electrochemical Society, 162(14), D630, 2015 |
| 2 |
Direct Electroless Plating of Iron-Boron on Copper Blickensderfer J, Altemare P, Thiel KO, Schreier HJ, Akolkar R Journal of the Electrochemical Society, 161(10), D495, 2014 |