검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
A method of fabricating metal-insulator-metal (MIM) capacitor in Cu/low-k backend interconnection process for RF application Yu MB, Ning J, Balakumar S, Bliznetsov VN, Lo GQ, Balasubramanian N, Kwong DL Thin Solid Films, 504(1-2), 257, 2006 |
| 2 |
Comparative studies of physical and chemical properties of plasma-treated CVD low k SiOCH dielectrics Tsang CF, Su YJ, Bliznetsov VN Thin Solid Films, 462-63, 269, 2004 |
| 3 |
Deep trench etch and clean process technology for CU/SiOC passive device Yu MB, Bliznetsov VN, Chang CK, Murthy BR Thin Solid Films, 462-63, 302, 2004 |