검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Modeling pattern density dependent bump formation in copper electrochemical deposition Im YH, Bloomfield MO, Sen S, Cale TS Electrochemical and Solid State Letters, 6(3), C42, 2003 |
| 2 |
Extension velocities for level set based surface profile evolution Richards DF, Bloomfield MO, Sen S, Cale TS Journal of Vacuum Science & Technology A, 19(4), 1630, 2001 |