| 1 |
Correlation between physical bonding and mechanical properties of wood-plastic composites: part 2: effect of thermodynamic factors on interfacial bonding at wood-polymer interface
Niaraki PR, Krause A
Journal of Adhesion Science and Technology, 34(7), 756, 2020 |
| 2 |
De-bondable SiC-SiC wafer bonding via an intermediate Ni nano-film
Mu FW, Uomoto M, Shimatsu T, Wang YH, Iguchi K, Nakazawa H, Takahashi Y, Higurashi E, Suga T
Applied Surface Science, 465, 591, 2019 |
| 3 |
Interface characteristics comparison of sapphire direct and indirect wafer bonded structures by transmission electron microscopy
Li WW, Liang T, Liu WY, Lei C, Hong YP, Li YW, Li ZQ, Xiong JJ
Applied Surface Science, 494, 566, 2019 |
| 4 |
Buried interfaces - A systematic study to characterize an adhesive interface at multiple scales
Haubrich J, Lobbecke M, Watermeyer P, Wilde F, Requena G, da Silva J
Applied Surface Science, 433, 546, 2018 |
| 5 |
Direct bonding of silicon and quartz glass using VUV/O-3 activation and a multistep low-temperature annealing process
Xu JK, Wang CX, Wang T, Liu YN, Tian YH
Applied Surface Science, 453, 416, 2018 |
| 6 |
Progressive failure of bamboo-steel adhesive bonding interface subjected low-energy impact and tension in sequence
Zhang ZW, Li YS, Liu R, Zhang JL
Journal of Adhesion Science and Technology, 32(7), 721, 2018 |
| 7 |
GaN-Si direct wafer bonding at room temperature for thin GaN device transfer after epitaxial lift off
Mu FW, Morino Y, Jerchel K, Fujino M, Suga T
Applied Surface Science, 416, 1007, 2017 |
| 8 |
Repeatable adhesion by proton donor-acceptor interaction of polymer brushes
Yoshioka H, Izumi C, Shida M, Yamaguchi K, Kobayashi M
Polymer, 119, 167, 2017 |
| 9 |
Chemical bonding states at the polymer/metal interface and their effects on the capacitance-voltage characteristics of the ferroelectric poly(vinylidene fluoride-trifluoroethylene) copolymer thin films
Lee WG, Park BE, Jeon HS, Park KE
Thin Solid Films, 565, 215, 2014 |
| 10 |
Fabrication of bonded GeOI substrates with thin Al2O3/SiO2 buried oxide layers
Moriyama Y, Ikeda K, Kamimuta Y, Oda M, Irisawa T, Nakamura Y, Sakai A, Tezuka T
Solid-State Electronics, 83, 42, 2013 |
