화학공학소재연구정보센터
검색결과 : 8건
No. Article
1 Characterizing and predicting spatial nonuniformity in the deep reactive ion etching of silicon
Taylor HK, Sun HW, Hill TF, Farahanchi A, Boning DS
Journal of the Electrochemical Society, 153(8), C575, 2006
2 Damascene chemical-mechanical polishing characterization and modeling for polysilicon microelectromechanical systems structures
Tang BD, Xie XL, Boning DS
Journal of the Electrochemical Society, 152(7), G582, 2005
3 Simultaneous fault detection and classification for semiconductor manufacturing tools
Goodlin BE, Boning DS, Sawin HH, Wise BM
Journal of the Electrochemical Society, 150(12), G778, 2003
4 Modeling of reverse tone etchback shallow trench isolation chemical mechanical polishing
Gan T, Tugbawa T, Lee B, Boning DS, Jang S
Journal of the Electrochemical Society, 148(3), G159, 2001
5 On-line patterned wafer thickness control of chemical-mechanical polishing
Smith TH, Fang SJ, Stefani JA, Shinn GB, Boning DS, Butler SW
Journal of Vacuum Science & Technology A, 17(4), 1384, 1999
6 A novel statistical metrology framework for identifying sources of variation in oxide chemical-mechanical polishing
Divecha RR, Stine BE, Ouma DO, Chang EC, Boning DS, Chung JE, Nakagawa OS, Aoki H, Ray G, Bradbury D, Oh SY
Journal of the Electrochemical Society, 145(3), 1052, 1998
7 Artificial Neural-Network Exponentially Weighted Moving Average Controller for Semiconductor Processes
Smith TH, Boning DS
Journal of Vacuum Science & Technology A, 15(3), 1377, 1997
8 End-Point Prediction for Polysilicon Plasma Etch via Optical-Emission Interferometry
Wong K, Boning DS, Sawin HH, Butler SW, Sachs EM
Journal of Vacuum Science & Technology A, 15(3), 1403, 1997