화학공학소재연구정보센터
검색결과 : 31건
No. Article
1 Temperature and RF Current Sensor Wafers for Plasma Etching
Milenin AP, Demand M, Boullart W, Arleo P
Journal of the Electrochemical Society, 159(1), H5, 2012
2 Metrology for Implanted Si Substrate Loss Studies
Radisic D, Shamiryan D, Mannaert G, Boullart W, Rosseel E, Bogdanowicz J, Goossens J, Marrant K, Bender H, Sonnemans R, Berry I
Journal of the Electrochemical Society, 157(5), H580, 2010
3 TaN metal gate etch mechanisms in BCl3-based plasmas
Shamiryan D, Danila A, Baklanov MR, Boullart W
Journal of Vacuum Science & Technology A, 28(2), 302, 2010
4 Effect of energetic ions on plasma damage of porous SiCOH low-k materials
Kunnen E, Baklanov MR, Franquet A, Shamiryan D, Rakhimova TV, Urbanowicz AM, Struyf H, Boullart W
Journal of Vacuum Science & Technology B, 28(3), 450, 2010
5 Impact of metal etch residues on etch species density and uniformity
Dictus D, Shamiryan D, Paraschiv V, Boullart W, De Gendt S, Vinckier C
Journal of Vacuum Science & Technology B, 28(4), 789, 2010
6 Unusual Modification of CuCl or CuBr Films by He Plasma Exposure Resulting in Nanowire Formation
Dictus D, Baklanov MR, Pikulev V, De Gendt S, Vinckier C, Boullart W, Vanhaelemeersch S
Langmuir, 26(3), 2014, 2010
7 SELECTIVE REMOVAL OF HIGH-K GATE DIELECTRICS
Shamiryan D, Baklanov M, Claes M, Boullart W, Paraschiv V
Chemical Engineering Communications, 196(12), 1475, 2009
8 Effect of etch-clean delay time on post-etch residue removal for front-end-of-line applications
Vos I, Hellin D, Vereecke G, Pavel E, Boullart W, Vertommen J
Journal of Vacuum Science & Technology B, 27(5), 2301, 2009
9 Using ellipsometry for assessment of TiN surface roughness after plasma etch
Shamiryan D, Paraschiv V, Dictus D, Baklanov MR, Beckx S, Boullart W
Journal of the Electrochemical Society, 155(2), H108, 2008
10 High aspect ratio via etch development for Cu nails in 3-D-stacked ICs
Van Aelst J, Struyf H, Boullart W, Vanhaelemeersch S
Thin Solid Films, 516(11), 3502, 2008