검색결과 : 6건
| No. | Article |
|---|---|
| 1 |
Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias Braun TM, Josell D, Silva M, Kildon J, Moffat TP Journal of the Electrochemical Society, 166(1), D3259, 2019 |
| 2 |
Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction (vol 165, pg D23, 2018) Braun TM, Kim SH, Lee HJ, Moffat TP, Josell D Journal of the Electrochemical Society, 165(11), X11, 2018 |
| 3 |
Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction Braun TM, Kim SH, Lee HJ, Moffat TP, Josell D Journal of the Electrochemical Society, 165(7), D291, 2018 |
| 4 |
Remote Control Electrodeposition: Principles for Bipolar Patterning of Substrates without an Electrical Connection Braun TM, Schwartz DT Journal of the Electrochemical Society, 163(12), D3014, 2016 |
| 5 |
Analytical and Computational Scaling Relationships for the Coupled Phenomena that Control Local Bipolar Electrochemical Behavior Braun TM, Schwartz DT Journal of the Electrochemical Society, 163(13), E354, 2016 |
| 6 |
Localized Electrodeposition and Patterning Using Bipolar Electrochemistry Braun TM, Schwartz DT Journal of the Electrochemical Society, 162(4), D180, 2015 |