화학공학소재연구정보센터
검색결과 : 9건
No. Article
1 Flexible Low-Voltage Organic Complementary Circuits: Finding the Optimum Combination of Semiconductors and Monolayer Gate Dielectrics
Kraft U, Sejfic M, Kang MJ, Takimiya K, Zaki T, Letzkus F, Burghartz JN, Weber E, Klauk H
Advanced Materials, 27(2), 207, 2015
2 Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips
Harendt C, Kostelnik J, Kugler A, Lorenz E, Saller S, Schreivogel A, Yu ZL, Burghartz JN
Solid-State Electronics, 113, 101, 2015
3 Thermal characterization and modeling of ultra-thin silicon chips
Alshahed M, Yu ZL, Rempp H, Richter H, Harendt C, Burghartz JN
Solid-State Electronics, 113, 121, 2015
4 Compensation of externally applied mechanical stress by stacking of ultrathin chips
Endler S, Rempp H, Harendt C, Burghartz JN
Solid-State Electronics, 74, 102, 2012
5 Compact modeling of CMOS transistors under variable uniaxial stress
Wacker N, Richter H, Hassan MU, Rempp H, Burghartz JN
Solid-State Electronics, 57(1), 52, 2011
6 Ultra-thin chip technology and applications, a new paradigm in silicon technology
Burghartz JN, Appel W, Harendt C, Rempp H, Richter H, Zimmermann M
Solid-State Electronics, 54(9), 818, 2010
7 Modeling of strained CMOS on disposable SiGe dots: Shape impacts on electrical/thermal characteristics
Fregonese S, Zhuang Y, Burghartz JN
Solid-State Electronics, 52(6), 919, 2008
8 Integrated RF inductors with micro-patterned NiFe core
Zhuang Y, Vroubel M, Rejaei B, Burghartz JN
Solid-State Electronics, 51(3), 405, 2007
9 Extraction of collector resistances for device characterization and compact models
Wu HC, Mijalkovic S, Burghartz JN
Solid-State Electronics, 50(9-10), 1475, 2006