| 1 |
Effect of slurry aging on stability and performance of chemical mechanical planarization process
Basim GB
Advanced Powder Technology, 22(2), 257, 2011 |
| 2 |
기계화학적 연마용 실리카 연마재의 형상과 크기가 산화막 연마율에 미치는 영향
이진호, 임형미, 허수현, 정정환, 김대성, 이승호
Applied Chemistry for Engineering, 22(6), 631, 2011 |
| 3 |
Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurry. Part I. Elucidating slurry chemistry
Nagar M, Starosvetsky D, Vaes J, Ein-Eli Y
Electrochimica Acta, 55(10), 3560, 2010 |
| 4 |
Potassium sorbate solutions as copper chemical mechanical planarization (CMP) based slurries
Abelev E, Smith AJ, Hassel AW, Ein-Eli Y
Electrochimica Acta, 52(16), 5150, 2007 |
| 5 |
Dependence of Nanotopography Impact on Fumed Silica and Ceria Slurry Added with Surfactant for Shallow Trench Isolation Chemical Mechanical Polishing
Cho KC, Jeon H, Park JG
Korean Journal of Materials Research, 16(5), 308, 2006 |
| 6 |
Mechanochemical synthesis of nano-sized CeO2 and its application for CMP slurry
Lim G, Lee JH, Kim J, Lee HW, Hyun SH
Materials Science Forum, 449-4, 1105, 2004 |
| 7 |
Effect of soft agglomerates on CMP slurry performance
Basim GB, Moudgil BM
Journal of Colloid and Interface Science, 256(1), 137, 2002 |
| 8 |
[기획특집-고부가 정보소재 개발 현황] CMP 공정용 슬러리의 제조 및 기술 개발 현황
이종규, 김익범, 김진두
Prospectives of Industrial Chemistry, 5(2), 20, 2002 |
