검색결과 : 13건
No. | Article |
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1 |
Atomic Layer Deposition of L-Alanine Polypeptide Fu Y, Li BS, Jiang YB, Dunphy DR, Tsai A, Tam SY, Fan HY, Zhang HX, Rogers D, Rempe S, Atanassov P, Cecchi JL, Brinker CJ Journal of the American Chemical Society, 136(45), 15821, 2014 |
2 |
Sub-10 nm thick microporous membranes made by plasma-defined atomic layer deposition of a bridged silsesquioxane precursor Jiang YB, Xomeritakis G, Chen Z, Dunphy D, Kissel DJ, Cecchi JL, Brinkertt CJ Journal of the American Chemical Society, 129(50), 15446, 2007 |
3 |
Nanometer-thick conformal pore sealing of self-assembled mesoporous silica by plasma-assisted atomic layer deposition Jiang YB, Liu NG, Gerung H, Cecchi JL, Brinker CJ Journal of the American Chemical Society, 128(34), 11018, 2006 |
4 |
Plasma science and technology: 50 years of progress Cecchi JL, Cecchi LM Journal of Vacuum Science & Technology A, 21(5S), S129, 2003 |
5 |
Diode laser measurements of CFx species in a low-pressure, high-density plasma reactor Littau ME, Sowa MJ, Cecchi JL Journal of Vacuum Science & Technology A, 20(5), 1603, 2002 |
6 |
Response surface modeling of the composition of AlAsySb1-y alloys grown by molecular beam epitaxy Gopaladasu P, Cecchi JL, Malloy KJ, Kaspi R Journal of Crystal Growth, 225(2-4), 556, 2001 |
7 |
Fluorocarbon polymer deposition kinetics in a low-pressure, high density, inductively coupled plasma reactor Sowa MJ, Littau ME, Pohray V, Cecchi JL Journal of Vacuum Science & Technology A, 18(5), 2122, 2000 |
8 |
Investigation of the kinetics of tungsten chemical mechanical polishing in potassium iodate-based slurries - I. Role of alumina and potassium iodate Stein DJ, Hetherington DL, Cecchi JL Journal of the Electrochemical Society, 146(1), 376, 1999 |
9 |
Investigation of the kinetics of tungsten chemical mechanical polishing in potassium iodate-based slurries II. Roles of colloid species and slurry chemistry Stein DJ, Hetherington DL, Cecchi JL Journal of the Electrochemical Society, 146(5), 1934, 1999 |
10 |
In situ electrochemical investigation of tungsten electrochemical behavior during chemical mechanical polishing Stein DJ, Hetherington D, Guilinger T, Cecchi JL Journal of the Electrochemical Society, 145(9), 3190, 1998 |